Semiconductor storage device having page copying function

ABSTRACT

Data read from memory cells of one page in a memory cell array that corresponds to a page address of a copy source is sensed and latched by a sense/latch circuit. The sense/latch circuit has a plurality of latch circuits, and the plurality of latch circuits is specified according to the column address. The latch circuit specified in accordance with the column address is supplied with the data to be rewritten. The latch circuit specified in accordance with its address latches the data to be rewritten, whereby rewriting of the data is performed. The data of one page after rewritten is written into the page in the memory cell array that corresponds to the page address of a copy destination.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of Ser. No. 11/582,065, filed Oct.17, 2006, which is issuing as U.S. Pat. No. 7,315,473 on Jan. 1, 2008,which is a continuation of Ser. No. 11/328,681, filed Jan. 9, 2006, nowU.S. Pat. No. 7,130,217, which is a continuation of U.S. applicationSer. No. 11/219,193, filed Sep. 2, 2005, now U.S. Pat. No. 7,082,054,which is a continuation of U.S. application Ser. No. 10/699,398, filedOct. 31, 2003, now U.S. Pat. No. 7,016,228, which is a continuation ofSer. No. 10/194,337, filed Jul. 12, 2002, now U.S. Pat. No. 6,661,706,the entire contents of which are incorporated herein by reference.

This application is based upon and claims the benefit of priority fromthe prior Japanese Patent Application No. 2001-216980, filed Jul. 17,2001, the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor storage device having adata copying function that writes data stored in an area of a memorycell array into another area, and more particularly to a flash memory towhich a large batch of data is written.

2. Description of the Related Art

A NAND flash memory is known as a kind of a non-volatile memory. In theNAND flash memory, a plurality of memory cells constituting non-volatiletransistors are connected in series to form a NAND cell. Data writing isapplied to a plurality of memory cells in parallel, and data erasure isperformed electrically by batching data on the basis of a block unitthat is constituted of a plurality of NAND cells. The data writing inthe NAND flash memory comprises sequentially supplying a sense/latchcircuit that includes a plurality of latch circuits with data to bewritten, and supplying a memory cell array with the data latched by thesense/latch circuit via a bit line.

The reason why the data to be written is latched by the sense/latchcircuit is that a data writing method of the NAND flash memory is one inwhich writing is performed by batching a large quantity of data in orderto accelerate the effective speed. A writing unit in the NAND flashmemory is called one page. Normally, one page is constituted of aplurality of memory cells having a common word line.

When data writing is performed with a NAND flash memory, normally, onebatch of data is written in one block because of the simplicity in datamanagement. This makes a free area in one block fairly large, resultingin ineffective use of a data area.

In FIG. 1, a plurality of blocks 52 are provided in a memory cell array51. In each of the blocks 52, areas that are shaded indicate where datais written, and other areas indicate where data is not written.

Therefore, when a NAND flash memory is used, data of one page in acertain block is read out from the data that has once been written, andthe read data is temporarily latched by the sense/latch circuit. Thedata latched by the sense/latch circuit is then written into a page ofthe free area in a block that is different from the block where the datawas read out. This enables effective use of memory space. Such anoperation is called page copying. Page copying enables effective use ofmemory space.

As shown in FIG. 2, the NAND flash memory has a data area 53 for storingusual data, and in addition to this, the memory space called a redundantarea 54. The redundant area 54 is the shaded area in FIG. 2. Thisredundant area 54 is provided in every page, and is usually used forstoring data concerned with the data storage state of each page. Forexample, state of a page can be written in the redundant area 54; anerror check code (ECC) used for error correction of data, dataindicating that data of the corresponding page is erasable, and dataindicating that the data of the corresponding page is copied data.

If page copying is performed, the data read from the page of a copysource is written into the page of a copy destination as it is,including the data in the redundant area 54. As a result, in thedestination where the page is copied, the data in the redundant area 54does not reflect the state of the page correctly. When performing pagecopying, it is necessary to be able to rewrite the data with regard tothe redundant area 54 while keeping the data in the data area 53 as itis.

However, it has been impossible to rewrite part of the data inconventional page copying without reading data out of the memory. Thishas led to a desire for the NAND flash memory capable of rewriting partof the data during the page copying.

BRIEF SUMMARY OF THE INVENTION

According to a first aspect of the present invention, there is provideda semiconductor storage device comprises: a memory cell array which datais written into and read from every page; and control circuits,connected to the memory cell array, for rewriting at least part of thedata in the data of one page read from an arbitrary page in the memorycell array, and writing the rewritten data into another page in thememory cell array.

According to a second aspect of the present invention, there is provideda semiconductor storage device comprises: a memory cell arrayconstituted of a plurality of word lines, a plurality of bit lines, anda plurality of memory cells which are connected to the plurality of wordlines and the plurality of bit lines, data writing and data reading areperformed for every page that is constituted of the plurality of memorycells commonly connected to one word line; a row decoder connected tothe plurality of word lines for selecting an arbitrary word line fromthe plurality of word lines and selecting an arbitrary page in thememory cell array; and a sense/latch circuit connected to the pluralityof word lines for sensing data of one page read from the memory cellarray and latching the sensed data when reading data from the memorycell array, and for supplying the memory cell array with the latcheddata of one page and rewriting arbitrary data from the latched data ofone page when writing data in the memory cell array.

According to a third aspect of the present invention, there is providedan operation method of a semiconductor storage device comprises: readingdata in parallel from a plurality of memory cells in a certain memoryarea of a non-volatile semiconductor storage device that has a pluralityof memory areas each including a plurality of memory cells; latching theread data by a plurality of latch circuits, and rewriting at least partof the data latched by the plurality of latch circuits; and writing thedata at least part of which is rewritten into the plurality of memorycells of the memory area that is different from the memory area fromwhich the data is read.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1 is a block diagram of a memory cell array of a conventional NANDflash memory.

FIG. 2 is a view showing memory space of the NAND flash memory of FIG.1.

FIG. 3 is a block diagram of the NAND flash memory in one embodiment ofthe present invention.

FIG. 4 is a circuit diagram showing a detailed constitution of one blockof the memory cell array of FIG. 3.

FIG. 5 is a circuit diagram showing a detailed constitution of a part,which is related to one NAND cell of the memory cell array of FIG. 3, ofa sense/latch circuit.

FIG. 6 is a circuit diagram schematically showing the relation between aplurality of latch circuits and a plurality of bit lines provided in thesense/latch circuit of FIG. 3.

FIG. 7 is a flowchart showing a page copying operation of the NAND flashmemory of FIG. 3.

FIG. 8 is a signal waveform view of essential parts during the pagecopying operation of the NAND flash memory of FIG. 3.

FIG. 9 is a block diagram schematically showing a state in which data tobe rewritten is supplied to a latch circuit group during the pagecopying operation of the NAND flash memory of FIG. 3.

FIG. 10 is a view showing the changing state of some of the data in thelatch circuit group during the page copying operation of the NAND flashmemory of FIG. 3.

FIG. 11 is a block diagram showing the positional relation of data ofone page before and after the page copying operation of the NAND flashmemory of FIG. 3.

DETAILED DESCRIPTION OF THE INVENTION

One embodiment of the present invention will be described in detail withreference to the drawings.

FIG. 3 is a block diagram showing an entire constitution of an NANDflash memory according to one embodiment of the present invention.

In a memory cell array 11, a plurality of word lines, a select gateline, and a bit line are provided.

A plurality of memory cells are connected to the plurality of word linesand the bit line. As described later, the plurality of memory cells isdivided into a plurality of blocks.

The memory cell array 11 is connected to a sense/latch circuit 12 and arow decoder circuit 13 that selectively drives the plurality of wordlines and the select gate line.

The sense/latch circuit 12 has a plurality of latch circuits. Whenreading data from the memory cell array 11, the sense/latch circuit 12senses data to be read via the bit line and temporarily latches thesensed data. When writing data into the memory cell array 11, thesense/latch circuit 12 temporarily latches data to be written andsupplies the memory cell array 11 with the data via the bit line. Aninput-output buffer (I/O buffer) 14 and a column decoder circuit 15 areconnected to the sense/latch circuit 12. In data reading, among data tobe read that is latched by the sense/latch circuit 12, data selecteddepending on the decoding output of the column decoder circuit 15 isread to the outside of a memory via the I/O buffer 14. In data writing,data to be written supplied from the outside of the memory via the I/Obuffer 14 is sent to and latched by the latch circuit in the sense/latchcircuit 12 selected depending on the decoding output of the columndecoder circuit 15.

When reading and writing data, the row decoder circuit 13 selectivelydrives the word lines and select gate line in the memory cell array 11,and selects the memory cells of one page in the memory cell array 11 inparallel.

An address latch 16 is connected to the I/O buffer 14, and latches rowaddresses and column addresses input via the I/O buffer 14. The latchedrow addresses are supplied to the row decoder circuit 13, and the columnaddresses are supplied to the column decoder circuit 15.

A command latch 17 is connected to the I/O buffer 14, and latchescommand inputs input via the I/O buffer 14. A command decoder 18 isconnected to the command latch 17. The command decoder 18 decodescommands and outputs various kinds of control signals. On the basis ofthe control signals output from the command decoder 18, operations ofthe sense/latch circuit 12, the row decoder circuit 13, the I/O buffer14, the column decoder circuit 15, and the address latch 16 arecontrolled.

Apart from the circuits, the flash memory is provided with circuits suchas a high voltage/intermediate voltage generation circuit for generatinghigh voltage and intermediate voltages to be supplied to the row decodercircuit 13 and the memory cell array 11 when writing and erasing data.These circuits are not shown.

FIG. 4 shows a detailed circuit constitution of one block of the memorycell array 11 of FIG. 3 together with the sense/latch circuit 12.

A plurality of NAND cells 21 is provided in one block of the memory cellarray 11. A plurality of memory cells MC constituted of non-volatiletransistors having control gates and floating gates is provided in eachof the NAND cells 21. Source-drain paths of the plurality of memorycells MC are connected in series.

One end of a first select transistor SGT1 and one end of a second selecttransistor SGT2 for selecting a NAND cell are respectively connected toone end side and the other end side of the NAND cell. The other end ofeach of the first select transistors SGT1 is connected to thecorresponding bit line BL. The other end of each of the second selecttransistors SGT2 are all connected to the source line SL.

The control gates of the plurality of memory cells MC in one block arecommonly connected to corresponding ones of the plurality of word linesWLs that are provided extendedly through the block. The select gates ofthe first select transistors SGT1 and the select gates of the secondselect transistors SGT2 are commonly connected to a first select gateline SG1 and a second select gate line SG2 that are provided extendedlythrough the block, respectively. In the block, the plurality of memorycells MCs having their control gates commonly connected to one word lineconstitutes one page 22. When data is written, writing is performed inparallel on the basis of one-page unit in the memory cells of the memorycell array 11.

FIG. 5 shows a detailed circuit constitution of a part, which is relatedto one NAND cell 21 of FIG. 3, of the sense/latch circuit 12. The bitline BL is connected to a node 33 via in series a source-drain path of atransistor 31 for bit line selection and a source-drain path of atransistor 32 that is controlled to be conducted when the bit line BL isselected, respectively. Between the node 33 and a supply node of a powersupply voltage Vcc, a source-drain path of a precharging transistor 34for precharging the node 33 are inserted.

Two inverters 35 and 36 constitute a latch circuit 37. When reading datafrom the memory cells MC, the latch circuit 37 senses and latches datastored in the memory cell MC. When writing data into the memory cell MC,the latch circuit 37 latches data to be written supplied from theoutside. An input node of the inverter 35 in the latch circuit 37 isconnected to the node 33 via the source-drain path of a transistor 38which is controlled to be conducted when the data is read from andwritten into the memory cell MC. An output node of the other inverter 36in the latch circuit 37 is connected to an I/O line via a source-drainpath of a transistor 39 for column selection. An output node of theinverter 35 is connected to an I/Ob line via a source-drain path of atransistor 40 for the column selection. The I/O line and the I/Ob lineare both connected to the I/O buffer 14 of FIG. 3.

A circuit constituted of an NAND circuit 41 and an inverter 42 outputs acontrol signal for controlling to conduct the transistors 39 and 40 forthe column selection. A decode output signal of the column data circuit15 and a column select enable signal CSLEN are input to the NAND circuit41. An output signal of the NAND circuit 41 is input to the inverter 42.An output signal of the inverter 42 is input in parallel to each gate ofthe transistors 39 and 40 for the column selection.

FIG. 6 schematically shows the relation between a plurality of latchcircuits 37 and a plurality of bit lines provided in the sense/latchcircuit 12 of FIG. 3. In the sense/latch circuit 12, the latch circuits37 are provided for a parallel bit number of I/O data, that is, a numberof I/O line pairs consisting of the I/O line and the I/Ob line. Forexample, if the parallel bit number of the I/O data is eight bits, eightlatch circuits 37 are provided for every eight NAND cells 21. The eightlatch circuits 37 are connected in series to constitute a latch circuitgroup 43. In the sense/latch circuit 12, the latch circuit groups 43 areprovided for the number of columns in the memory cell array 11. Whenreading data from the memory cell array 11, each of the latch circuitgroups 43 temporarily latches the data read from the correspondingmemory cells. When writing data, each of the latch circuit group 43latches data to be written for one byte (eight bits) sent from the I/Obuffer 14. A plurality of the latch circuit groups 43 is selected inaccordance with column addresses.

Next, the page copying operation performed in the memory having such aconstitution will be described with reference to FIG. 7 to FIG. 10.

First described will be a page data reading operation in which the pageof a copy source is specified and data of one page is read.

In the page data reading operation, first, as shown in step ST1 of FIG.7, an address input command “00h” is latched by the command latch 17.“h” in the command “00h” indicates that the data is hexadecimal data.Next, as shown in step ST2, a column address input of a copy sourceaddress is latched by the address latch 16. Then, as shown in step ST3,a row address input of the copy source address is latched by the addresslatch 16. When the address input command and the copy source address arelatched, a command latch enable signal CLE and an address latch enablesignal ALE are each set for “H” level, as shown in FIG. 8.

The column address latched by the address latch 16 is sent to the columndecoder circuit 15, and the row address is sent to the row decodercircuit 13. After this, one page of the memory cell array 11 from whichdata is read is specified according to the outputs of the column decodercircuit 15 and the row decoder circuit 13.

After this, as shown in step ST4, a read command “35h” is latched by thecommand latch 17. After the read command is input, data is sequentiallyread from the specified memory cells of one page in the memory cellarray 11 in synchronization with a read enable signal RE. The read dataof one page is sensed and temporarily latched by the sense/latch circuit12.

This data reading operation will be described using the circuit of FIG.5. Prior to reading data from each of the plurality of memory cells MCprovided in the NAND cell 21, the transistor 34 is conducted, and thenode 33 is precharged to a level “H” that corresponds to the powersupply voltage Vcc. When the data is read, the transistors 31 and 32 areconducted, and the “H” level of the node 33 is transmitted to the bitline BL. Depending upon the stored data in the memory cells MC selectedin the NAND cell 21, the potential of the bit line BL maintains theprecharged level or is discharged to a level “L” to be lowered. In otherwords, the potential of the node 33 is decided in accordance with thestored data in the selected memory cell.

Furthermore, after the transistors 31 and 32 are conducted and thepotential of the node 33 is decided in accordance with the stored dataof the selected memory cell, the transistor 38 is conducted, and thepotential of the node 33 is sent to the latch circuit 37. At this point,if the potential of the node 33 is on the level “L”, the latch circuit37 performs data sensing so that the I/O side will be on the level “H”and the I/Ob side will be on the level “L”, and latches the sensed data.

Next, a data rewriting operation will be described in which the columnaddress to be rewritten is specified in the data of one page that hasbeen read and data input is performed.

In the data rewriting operation, as shown in step ST5 of FIG. 7, arewrite command “85h” is latched by the command latch 17. Next, as shownin step ST6, the column address of the copy destination addresscorresponding to the latch circuit 37 that rewrites data is latched bythe address latch 16. Then, as shown in step ST7, the row address of thecopy destination address is latched by the address latch 16. Further, asshown in step ST8, the data to be rewritten is input to the sense/latchcircuit 12 via the I/O buffer 14.

At this point, the column address latched by the address latch 16 issent to the column decoder circuit 15, and the page address of the copydestination, that is, the row address is sent to the row decoder circuit13. The data to be rewritten supplied from the I/O buffer 14 is sent toone of the plurality of latch circuit groups 43 in the sense/latchcircuit 12 in accordance with the output of the column decoder circuit15, and its eight latch circuits 37 sequentially perform data rewriting.

This data rewriting operation will be described using the circuit ofFIG. 5. The data to be rewritten from the I/O buffer 14 is transmittedto the data line I/O and the data line I/Ob. Further, the decodingoutput of the column decoder circuit 15 to which the column address isinput reaches the level “H”, and the column select enable signal CSLENreaches the level “H”. Accordingly, the output signal of the NANDcircuit 41 reaches the level “L”, and the output signal of the inverter42 reaches the level “H”. Consequently, the transistors 39 and 40 forcolumn selection are conducted. As a result, the data to be rewritten issupplied to the latch circuit 37, and the data in the latch circuit 37is rewritten.

For example, as shown in FIG. 9, column numbers “0” to “527” areallotted to the latch circuit groups 43 that are each constituted ofeight latch circuits 37. If the column number “527” is specified, thedata to be rewritten from the I/O buffer 14 is input to the latchcircuit group 43 that corresponds to the column number “527”, as shownin FIG. 9. The eight latch circuits 37 that constitute the latch circuitgroup 43 are connected in series. The column select enable signal CSLENchanges from the level “L” to the level “H” successively eight times asshown in FIG. 8. This makes the data to be rewritten of eight bitssequentially transfer to the eight latch circuits 37 one after anotherto be latched thereby. As a result, the latched data of the eight latchcircuits 37 in the latch circuit group 43 is replaced with the rewrittendata. At this point, the data in the latch circuit group 43 that doesnot need to be rewritten remains as it is. Only the latched data in thelatch circuit group 43 to which the rewritten data is input after theinput of the address is rewritten.

As shown in FIG. 10, when there are 528 patterns “0” to “527” of thecolumn numbers, the area of “0” to “511” in the data of one page is thedata area, and the area of “512” to “527” is the redundant area. Afterthe data is read from the memory cell array 11, the latched data ofsixteen latch circuit groups 43 that correspond to the column number“512” to “527” of the redundant area is, for example, “01”. In thiscase, if the rewritten data “FF” is input to each of the latch circuitgroups 43, the data in the latch circuit groups 43 is changed to “FF”after the rewriting.

Next, as shown in step ST9 of FIG. 7, whether the rewriting has beenfinished or not is judged. If it has not, back in step ST5, the data inthe latch circuit group 43 is rewritten to the data to be rewritten. Ifit is judged that the rewriting has been finished in step ST9, a writecommand “10h” is latched by the command latch 17 as shown in step ST10.The write command is latched and decoded, thereby having the latcheddata in the latch circuit group 43 written into the page of the copydestination in the memory cell array 11. The page address of the copydestination for the writing has already been input in step ST7. On thebasis of the row address that corresponds to the page address of thecopy destination, the word lines in the memory cell array 11 areselectively driven, and the data writing is performed.

If such an operation is performed, as shown in FIG. 11, for example,data of one page 22 a in a block MBL0 that is in the memory cell array11 is read by the latch circuit group 43. After a part of the read data,for example, the data in the above redundant area is rewritten, the readdata is written into a page 22 b in a block MBL1 that is different fromthe above one.

In the above description, the way of driving the first and second selectgate lines SG1 and SG2 has not been described. When the block thatcorresponds is selected, the first and second select gate lines SG1 andSG2 are driven in accordance with the output of the row decoder circuit13. Thereby, first and second select transistors SGT1 and SGT2 that areconnected to all the NAND cells 21 in one block are controlled to beconducted. Accordingly, one end of each NAND cell 21 is connected to thecorresponding bit line BL via each first select transistor SGT1, and theother end of each NAND cell 21 is connected to the source line SL viaeach second select transistor SGT2. When the data is read, the sourceline SL is supplied with low potential that corresponds to the level“L”. When the data is written, the source line SL is put in apotentially floating state.

According to the above embodiment, in the memory that writes a largequantity of data as a batch, when rewriting data written in one pageinto a different page, it is possible to rewrite and copy only the datathat needs to be rewritten, with copied data as it is.

Additional advantages and modifications will readily occur to thoseskilled in the art. Therefore, the invention in its broader aspects isnot limited to the specific details and representative embodiments shownand described herein. Accordingly, various modifications may be madewithout departing from the spirit or scope of the general inventionconcept as defined by the appended claims and their equivalents. Forexample, the hexadecimal command data in the above description is merelyone example, and hence the present invention is not limited thereto.Further, in the above embodiment, it has been described that after thedata of one page in the memory cell array is read, the read data in theredundant area is rewritten, and then the data is written into adifferent page. The read data not only in the redundant area but also inthe data area may be rewritten. In this case, after the data of one pagein the memory cell array is read by the sense/latch circuit 12, anarbitrary column in the sense/latch circuit 12 is selected, and data tobe rewritten is supplied to the sense/latch circuit 12. It is therebypossible to rewrite the data of one page of the arbitrary column thathas been read out in the sense/latch circuit 12 and write it into thedifferent page.

Furthermore, in the above embodiment, it has been described that thesemiconductor storage device is the NAND flash memory having the NANDcells. Other than this, the semiconductor storage device may be anon-volatile memory having such as NOR-type cells, DINOR cell type, ANDcell type, NOR cell type with selective transistors.

1. A method of accessing a nonvolatile semiconductor memory devicecomprising a nonvolatile memory cell array having first and secondpages, the nonvolatile semiconductor memory device further comprising alatch circuit coupled to the memory cell array, the method comprising:supplying a first command, then supplying a first column address, thensupplying a first row address for a first page, and then supplying asecond command to cause transfer of data stored in the first page to thelatch circuit; after the transfer is completed, supplying a thirdcommand, then supplying a second column address, then supplying a secondrow address for a second page, then supplying a superseding data to thenonvolatile semiconductor memory device to change a portion of thetransferred data in the latch circuit while allowing the other portionof the transferred data to stay unchanged in the latch circuit; and thensupplying a fourth command to initiate programming into the second pageaccording to the superseding data and the other portion of thetransferred data in the latch circuit, wherein at least a portion of thesuperseding data is stored in the second column address in the secondpage after the programming is completed, and the first page is differentfrom the second page.
 2. The method of accessing a nonvolatilesemiconductor memory device according to claim 1, wherein the datastored in a second column address in the first page is different fromthe data stored in the second column address in the second page.
 3. Themethod of accessing a nonvolatile semiconductor memory device accordingto claim 1, wherein the second column address is included in a redundantarea.
 4. The method of accessing a nonvolatile semiconductor memorydevice according to claim 1, wherein the first command, the secondcommand, the third command and the fourth command are supplied to thenonvolatile semiconductor memory device in response to a write enablesignal, and the first column address, the second column address, thefirst row address and the second row address are supplied to thenonvolatile semiconductor memory device in response to the write enablesignal.
 5. The method of accessing a nonvolatile semiconductor memorydevice according to claim 1, wherein the first command, the secondcommand, the third command, the fourth command, the first columnaddress, the second column address, the first row address and the secondrow address are supplied via the same I/O buffer.
 6. The method ofaccessing a nonvolatile semiconductor memory device according to claim1, wherein the nonvolatile semiconductor memory device comprising acontrol circuit which includes the latch circuit, and the latch circuitsenses and latches data of one page read from an arbitrary page in thememory cell array.
 7. The method of accessing a nonvolatilesemiconductor memory device according to claim 6, wherein the controlcircuit includes a data I/O circuit connected to the latch circuit whichoutputs data latched by the latch circuit and which gives supplied datato be written to the latch circuit.
 8. The method of accessing anonvolatile semiconductor memory device according to claim 1, whereinthe memory cell array includes a plurality of memory blocks and each ofthe plurality of memory blocks includes a plurality of pages.
 9. Themethod of accessing a nonvolatile semiconductor memory device accordingto claim 8, wherein the first page is included in a first block, and thesecond page is included in a second block which is different from thefirst block.
 10. The method of accessing a nonvolatile semiconductormemory device according to claim 1, wherein the superseding data issupplied in a unit of eight bits.
 11. A method of accessing anonvolatile semiconductor memory device comprising a nonvolatile memorycell array having first and second pages, the nonvolatile semiconductormemory device further comprising a latch circuit coupled to the memorycell array, the method comprising: supplying a first command, thensupplying a first column address, then supplying a first row address fora first page, and then supplying a second command to cause transfer ofdata stored in the first page to the latch circuit; after the transferis completed, supplying a toggling read enable signal to the nonvolatilesemiconductor memory device to read the transferred data out of thelatch circuit; then supplying a third command, then supplying a secondcolumn address, then supplying a second row address for a second page,then supplying a superseding data to the nonvolatile semiconductormemory device to change a portion of the transferred data in the latchcircuit while allowing the other portion of the transferred data to stayunchanged in the latch circuit; and then supplying a fourth command toinitiate programming into the second page according to the supersedingdata and the other portion of the transferred data in the latch circuit,wherein at least a portion of the superseding data is stored in thesecond column address in the second page after the programming iscompleted, and the first page is different from the second page.
 12. Themethod of accessing a nonvolatile semiconductor memory device accordingto claim 11, wherein the data stored in a second column address in thefirst page is different from the data stored in the second columnaddress in the second page.
 13. The method of accessing a nonvolatilesemiconductor memory device according to claim 11, wherein the secondcolumn address is included in a redundant area.
 14. The method ofaccessing a nonvolatile semiconductor memory device according to claim11, wherein the first command, the second command, the third command andthe fourth command are supplied to the nonvolatile semiconductor memorydevice in response to a write enable signal, and the first columnaddress, the second column address, the first row address and the secondrow address are supplied to the nonvolatile semiconductor memory devicein response to the write enable signal.
 15. The method of accessing anonvolatile semiconductor memory device according to claim 11, whereinthe first command, the second command, the third command, the fourthcommand, the first column address, the second column address, the firstrow address and the second row address are supplied via the same I/Obuffer.
 16. The method of accessing a nonvolatile semiconductor memorydevice according to claim 11, wherein the nonvolatile semiconductormemory device comprising a control circuit which includes the latchcircuit, and the latch circuit senses and latches data of one page readfrom an arbitrary page in the memory cell array.
 17. The method ofaccessing a nonvolatile semiconductor memory device according to claim16, wherein the control circuit includes a data I/O circuit connected tothe latch circuit which outputs data latched by the latch circuit andwhich gives supplied data to be written to the latch circuit.
 18. Themethod of accessing a nonvolatile semiconductor memory device accordingto claim 11, wherein the memory cell array includes a plurality ofmemory blocks and each of the plurality of memory blocks includes aplurality of pages.
 19. The method of accessing a nonvolatilesemiconductor memory device according to claim 18, wherein the firstpage is included in a first block, and the second page is included in asecond block which is different from the first block.
 20. The method ofaccessing a nonvolatile semiconductor memory device according to claim11, wherein the superseding data is supplied in a unit of eight bits.21. A method of accessing a nonvolatile semiconductor memory devicecomprising a nonvolatile memory cell array having first and secondpages, the nonvolatile semiconductor memory device further comprising alatch circuit coupled to the memory cell array, the nonvolatile memorycell array further comprising a plurality of memory cell array units,each of the plurality of memory cell units having a first selecttransistor, a second select transistor and a plurality of memory cellsconnected in series, the plurality of memory cells being positionedbetween the first select transistor and the second select transistor,the plurality of memory cell units being arranged in matrix in thenonvolatile memory cell array; the method comprising: supplying a firstcommand, then supplying a first column address, then supplying a firstrow address for a first page, and then supplying a second command tocause transfer of data stored in the first page to the latch circuit;after the transfer is completed, supplying a third command, thensupplying a second column address, then supplying a second row addressfor a second page, then supplying a superseding data to the nonvolatilesemiconductor memory device to change a portion of the transferred datain the latch circuit while allowing the other portion of the transferreddata to stay unchanged in the latch circuit; and then supplying a fourthcommand to initiate programming into the second page according to thesuperseding data and the other portion of the transferred data in thelatch circuit, wherein at least a portion of the superseding data isstored in the second column address in the second page after theprogramming is completed, and the first page is different from thesecond page.
 22. A method of accessing a nonvolatile semiconductormemory device comprising a nonvolatile memory cell array having firstand second pages, the nonvolatile semiconductor memory device furthercomprising a latch circuit coupled to the memory cell array, thenonvolatile memory cell array further comprising a plurality of memorycell array units, each of the plurality of memory cell units having afirst select transistor, a second select transistor and a plurality ofmemory cells connected in series, the plurality of memory cells beingpositioned between the first select transistor and the second selecttransistor, the plurality of memory cell units being arranged in matrixin the nonvolatile memory cell array; the method comprising: supplying afirst command, then supplying a first column address, then supplying afirst row address for a first page, and then supplying a second commandto cause transfer of data stored in the first page to the latch circuit;after the transfer is completed, supplying a toggling read enable signalto the nonvolatile semiconductor memory device to read the transferreddata out of the latch circuit; then supplying a third command, thensupplying a second column address, then supplying a second row addressfor a second page, then supplying a superseding data to the nonvolatilesemiconductor memory device to change a portion of the transferred datain the latch circuit while allowing the other portion of the transferreddata to stay unchanged in the latch circuit; and then supplying a fourthcommand to initiate programming into the second page according to thesuperseding data and the other portion of the transferred data in thelatch circuit, wherein at least a portion of the superseding data isstored in the second column address in the second page after theprogramming is completed, and the first page is different from thesecond page.
 23. A nonvolatile semiconductor memory device, comprising:a nonvolatile memory cell array having at least first and second blocks,each of the first and second blocks including a plurality of columns,each of the plurality of columns including a first select gatetransistor, a NAND cell, and a second select gate transistor, the firstselect gate transistor, the NAND cell, and the second select gatetransistor are connected in series, the first block including a firstpage and the second block including a second page; a data latch circuitcoupled to the nonvolatile memory cell array, the latch circuit capableof storing a chunk of data stored in the first page; a command latch anda decoder configured to receive a first command, a second command, athird command, and a fourth command; and an address latch configured toreceive a first page address for the first page and a second pageaddress for the second page, wherein the nonvolatile semiconductormemory device receives the first command followed by the first pageaddress in response to a control signal, after receiving the first pageaddress, the nonvolatile semiconductor memory device receives the secondcommand in response to the control signal to cause the data latchcircuit to store a source data based on a first chunk of data stored inthe first page, after receiving the second command, the nonvolatilesemiconductor memory device receives the third command followed by thesecond page address in response to the control signal, after receivingthe second page address, the nonvolatile semiconductor memory devicereceives a modifying data to supersede at least a portion of the sourcedata, the third command allows a remaining portion of the source dataother than the superseded portion of the source data to stay unchangedin the data latch circuit, and then the nonvolatile semiconductor memorydevice receives the fourth command in response to the control signal tocause the second page to store a destination data based on the modifyingdata and the remaining portion of the source data stored in the datalatch circuit.
 24. The nonvolatile semiconductor memory device accordingto claim 23, wherein the nonvolatile semiconductor memory devicereceives a first column address after receiving the first command andbefore receiving the first page address and receives a second columnaddress after receiving the third command and before receiving thesecond page address.
 25. The nonvolatile semiconductor memory deviceaccording to claim 24, wherein the first command is “00h”, the secondcommand is “35h”, the third command is “85h” and the fourth command is“10h”.
 26. The nonvolatile semiconductor memory device according toclaim 25, wherein each of the first and second pages has a data area anda redundant area.
 27. The nonvolatile semiconductor memory deviceaccording to claim 26, wherein the superseding data is received in aunit of eight bits.
 28. The nonvolatile semiconductor memory deviceaccording to claim 27, further comprising: series-connected transistorscoupling the data latch circuit to the nonvolatile memory cell array;and a precharging transistor coupled between a supply node and aconnecting node of the series-connected transistors.
 29. A nonvolatilesemiconductor memory device, comprising: a nonvolatile memory cell arrayhaving at least first and second blocks, each of the first and secondblocks including a plurality of columns, each of the plurality ofcolumns including a first select gate transistor, a NAND cell, and asecond select gate transistor, the first select gate transistor, theNAND cell, and the second select gate transistor are connected inseries, the first block including a first page and the second blockincluding a second page; a data latch circuit coupled to the nonvolatilememory cell array, the latch circuit capable of storing a chunk of datastored in the first page; a command latch and a decoder configured toreceive a first command, a second command, a third command, and a fourthcommand; and an address latch configured to receive a first page addressfor the first page and a second page address for the second page,wherein the nonvolatile semiconductor memory device receives the firstcommand followed by the first page address in response to a firstcontrol signal, after receiving the first page address, the nonvolatilesemiconductor memory device receives the second command in response tothe first control signal to cause the data latch circuit to store asource data based on a first chunk of data stored in the first page,after receiving the second command, the nonvolatile semiconductor memorydevice outputs the source data in response to a second control signal;after receiving the second command, the nonvolatile semiconductor memorydevice receives the third command followed by the second page address inresponse to the first control signal while allowing at least a portionof the source data to stay unchanged in the data latch circuit, then thenonvolatile semiconductor memory device receives the fourth command inresponse to the first control signal to cause the second page to store adestination data based on the unchanged portion of the source data inthe data latch circuit.
 30. The nonvolatile semiconductor memory deviceaccording to claim 29, wherein the nonvolatile semiconductor memorydevice receives a first column address after receiving the first commandand before receiving the first page address and receives a second columnaddress after receiving the third command and before receiving thesecond page address.
 31. The nonvolatile semiconductor memory deviceaccording to claim 30, wherein the first command is “00h”, the secondcommand is “35h”, the third command is “85h” and the fourth command is“10h”.
 32. The nonvolatile semiconductor memory device according toclaim 31, wherein each of the first and second pages has a data area anda redundant area.
 33. The nonvolatile semiconductor memory deviceaccording to claim 32, wherein the changed data is received in a unit ofeight bits.
 34. The nonvolatile semiconductor memory device according toclaim 33, further comprising: series-connected transistors coupling thedata latch circuit to the nonvolatile memory cell array; and aprecharging transistor coupled between a supply node and a connectingnode of the series-connected transistors.
 35. A nonvolatilesemiconductor memory device, comprising: a nonvolatile memory cell arrayhaving at least first and second blocks, each of the first and secondblocks including a plurality of columns, each of the plurality ofcolumns including a first select gate transistor, a NAND cell, and asecond select gate transistor, the first select gate transistor, theNAND cell, and the second select gate transistor are connected inseries, the first block including a first page and the second blockincluding a second page; a data latch circuit coupled to the nonvolatilememory cell array, the latch circuit capable of storing a chunk of datastored in the first page; a command latch and a decoder configured toreceive a first command, a second command, a third command, and a fourthcommand; and an address latch configured to receive a first page addressfor the first page and a second page address for the second page,wherein the nonvolatile semiconductor memory device receives the firstcommand followed by the first page address in response to a firstcontrol signal, after receiving the first page address, the nonvolatilesemiconductor memory device receives the second command in response tothe first control signal to cause the data latch circuit to store asource data based on a first chunk of data stored in the first page,after receiving the second command, the nonvolatile semiconductor memorydevice outputs the source data in response to a second control signal;after receiving the second command, the nonvolatile semiconductor memorydevice receives the third command followed by the second page address inresponse to the first control signal; after receiving the second pageaddress, the nonvolatile semiconductor memory device receives modifyingdata to supersede at least a portion of the source data, the thirdcommand allows a remaining portion of the source data other than thesuperseded portion of the source data to stay unchanged in the datalatch circuit, and then the nonvolatile semiconductor memory devicereceives the fourth command in response to the first control signal tocause the second page to store destination data based on the modifyingdata and the remaining portion of the source data in the data latchcircuit.
 36. The nonvolatile semiconductor memory device according toclaim 35, wherein the nonvolatile semiconductor memory device receives afirst column address after receiving the first command and beforereceiving the first page address and receives a second column addressafter receiving the third command and before receiving the second pageaddress.
 37. The nonvolatile semiconductor memory device according toclaim 36, wherein the first command is “00h”, the second command is“35h”, the third command is “85h”, and the fourth command is “10h”. 38.The nonvolatile semiconductor memory device according to claim 37,wherein each of the first and second pages has a data area and aredundant area.
 39. The nonvolatile semiconductor memory deviceaccording to claim 38, wherein the superseding data is received in aunit of eight bits.
 40. The nonvolatile semiconductor memory deviceaccording to claim 39, further comprising: series-connected transistorscoupling the data latch circuit to the nonvolatile memory cell array;and a precharging transistor coupled between a supply node and aconnecting node of the series-connected transistors.